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Manager, IC Package Integrated Design

Description

PRIMARY PURPOSE:

In charge of PIC and EIC integrated package design 

DUTIES & RESPONSIBILITIES: 

1.Survey and watch IC package technology trend to support product roadmap 

2.Integrated design manager to lead PIC/EIC integrated package design, validation& qualification 

3.Qualify new IC package technology in OSAT 

SCOPE:

1. Build up IC package technology/platform via internal and external package capability to support product roadmap 

2. Provide design guidelines for key components (e.g. PIC, EIC and etc..) based on IC package technology needs 

3. Lead PIC/EIC integrated package design, validation, failure analysis and qualification through coordinating relative expertise 

EDUCATION: 

REQUIRED: 

•Master or above degree 

•Major in EE, Electro-optical engineering, Electronics or relative departments 

WORK EXPERIENCE: 

REQUIRED: 

•At least 5 years of IC package design or process integration experiences 

PREFERRED: 

•Familiar with 2.5D package such as application of TSV, TIV and In-FO or FOWLP etc 

•IC failure analysis experiences 

SKILLS & ABILITIES: REQUIRED:

 •Project management 

•Communication in English 

•Good team player 


#LI-HC1 

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