Engineer, Hardware/Signal Integrity
Responsible for RF design and simulation for PIC, high speed optic transceiver and IC substrate design
DUTIES & RESPONSIBILITIES:
1.High-speed PIC RF design and validation
2.IC package substrate RF design and validation
3.Module circuit layout SI/PI simulation and optimization
4.Failure analysis at any RF design system
-Responsible for RF design and simulation for high speed optic transceiver or sub-assembly
-Perform signal integrity (SI), transmission line, power integrity (PI) design and analysis
-Create RF 3D modeling for whole RF signal path, and conduct time domain & frequency domain simulation to meet design target
-Provide RF design guideline to relevant engineers, such as rigid PCB stack-up, via structure, high speed ceramic, feed-through structure, bond wire, IC substrate, photonic IC etc.
-Perform high speed performance testing, failure analysis etc.
-Act as technical lead role in coordinating and cooperating with multi-site RF design engineers
-Support all NPI activities from feasibility study, concept design, until product final release
-Complete technical documents, including design files, test report, work instructions etc
REQUIRED:•Master degree or above, major in communication, electronics engineering or relative department
REQUIRED:•Work experience with Electromagnetic or Microwave field. PREFERRED:•2+years of SI analysis experience preferred.
SKILLS & ABILITIES:
REQUIRED:•Familiar with ANSYS SI tools HFSS, SIWAVE and PCB layout tool Allegro. •Have ability to solve technical issues in High-speed system design independently. PREFERRED:•Good teamwork, ownership. •Good communication skills in both Chinese and English.