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Engineer, Hardware/Signal Integrity

Description

SI/Hardware Engineer 

PRIMARY PURPOSE:

Responsible for RF design and simulation for PIC, high speed optic transceiver and IC substrate design 

DUTIES & RESPONSIBILITIES: 

1.High-speed PIC RF design and validation 

2.IC package substrate RF design and validation 

3.Module circuit layout SI/PI simulation and optimization 

4.Failure analysis at any RF design system 

SCOPE: 

-Responsible for RF design and simulation for high speed optic transceiver or sub-assembly 

-Perform signal integrity (SI), transmission line, power integrity (PI) design and analysis 

-Create RF 3D modeling for whole RF signal path, and conduct time domain & frequency domain simulation to meet design target 

-Provide RF design guideline to relevant engineers, such as rigid PCB stack-up, via structure, high speed ceramic, feed-through structure, bond wire, IC substrate, photonic IC etc. 

-Perform high speed performance testing, failure analysis etc. 

-Act as technical lead role in coordinating and cooperating with multi-site RF design engineers 

-Support all NPI activities from feasibility study, concept design, until product final release 

-Complete technical documents, including design files, test report, work instructions etc 

EDUCATION: 

REQUIRED:•Master degree or above, major in communication, electronics engineering or relative department 

WORK EXPERIENCE: 

REQUIRED:•Work experience with Electromagnetic or Microwave field. PREFERRED:•2+years of SI analysis experience preferred. 

SKILLS & ABILITIES: 

REQUIRED:•Familiar with ANSYS SI tools HFSS, SIWAVE and PCB layout tool Allegro. •Have ability to solve technical issues in High-speed system design independently. PREFERRED:•Good teamwork, ownership. •Good communication skills in both Chinese and English.

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